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Epoxy Adhesive Formulations

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Highlights

  • ISBN13:9780071455442
  • ISBN10:0071455442
  • Publisher:McGraw-Hill Education
  • Language:English
  • Author:Edward Petrie
  • Binding:Hardback
  • SUPC: SDL561304766

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Country of Origin or Manufacture or Assembly India
Common or Generic Name of the commodity Electrical & Electronic Engineering Books
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Description

Learn More about the Book

Unmodified, epoxy resins cause certain problems for both the adhesive formulator and end-user. They are often rigid and brittle; hence, impact resistance and peel strength are poor. For decades, Chemist have been vigorously working to minimize these major shortcomings. Based on a popular course sponsored by the Society of Plastics Engineers and written by an authority in the field, this comprehensive text presents a variety of methods to accomplish what up to now has been a formidable task. Beginning with epoxy chemistry, moving on to fillers, filler treatments, and surfactants, and ending with current and future development in formulating Epoxy Adhesives, this rigorous text addressed the problem of improving flexibility, durability and strength by adding chemical groups to the epoxy structure either via the base resin or the curing agent or by adding separate flexibilizing resins to the formulation to create an epoxy-hybrid adhesive.

On the Back Cover

CRITICAL CHEMICAL METHODS FOR INCREASING EPOXY STRENGTH, FLEXIBILITY, AND DURABILITY

  • Epoxy properties and characteristics
  • Techniques for improving epoxy strength, flexibility, and durability
  • Testing and quality control guidelines

Based on a popular course sponsored by the Society of Plastics Engineers, this comprehensive text presents a variety of methods to ensure optimum epoxy performance and reliability.

The book begins with the fundamentals of epoxy chemistry, then quickly moves on to topics such as: fillers, filler treatments, and surfactants. Inside the book you'll find techniques for improving flexibility, durability and strength of epoxy adhesive formulations.

Complete Details on Formulating Epoxy Adhesives, Including:

  • Chemical properties of various epoxies
  • Testing and quality control methods
  • Regulations and standards
  • Optimal formulations and manufacturing processes

SINGLE-SOURCE GUIDANCE ON THE FORMULATION OF EPOXY ADHESIVES:
* Introduction to the Formulation of Epoxy Adhesives * Epoxy Polymer Properties * Quality Control, Tests, and Regulations * Epoxy Resins * Epoxy Curing Agents and Catalysts * Modifying Constituents * Epoxy Polymer Morphology * Property Improvements via Formulation * Formulations Based on Type of Substrate * Formulations Based on Cure or Application Methods * Formulation Based on End Use * Formulation Based on Environment * Processing of Epoxy Formulations

About the Author

Edward Petrie has been active in the adhesives industry for over 35 years -- both in the formulation side and the end-use sides of the industry. He has a BS (Chemical Engineering) and MS (Polymer Science) degrees from Carnegie Mellon University and an MBA from Duquesne University. Throughout his 35 years in the industry.

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