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Sorry! Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering is sold out.

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Japan Steel Phone Logic Board BGA Repair Stencil for iPhone 7 7P Motherboard IC Chip Ball Soldering

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  • Shopaholic
  • SUPC: SDL715814024

Description

Features:

Efficient: quick alignment for operating of reballing
Easy: positioning pins for precise alignment
Durable: Long Time Operating and Usage Lifetime
Application Model: iphone 6s Plus, 6s
Function: Repairing or fixing problem of iphone 6s Plus 6s processor

Package includes:

1 x BGA Reballing Stencils for iPhone 6s/6SP

Details pictures:

Terms & Conditions

The images represent actual product though color of the image and product may slightly differ.

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